Texas-instruments Digital Signal Processor SM320F2812-HT Instrukcja Użytkownika Pobierz pdf (Strona 14)

SM320F2812-HT

SGUS062B–JUNE 2009 – REVISED JUNE 2011

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2.3 Die Layout

The SM320F2812 die layout is shown in Figure 2-1. See Table 2-3 for a description of each pad's

function.

Figure 2-1. SM320F2812 Die Layout

Table 2-2. Bare Die Information

DIE PAD

DIE PAD DIE BACKSIDE BACKSIDE

DIE SIZE DIE PAD SIZE COMPOSITI

COORDINATES THICKNESS FINISH POTENTIAL

219.4 x 207.0 (mils); Silicon with

55.0 x 64.0 (μm) See Table 2-3 11.0 mils AlCu/TiN Ground

5572.0 x 5258.0 (μm) backgrind

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